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MID and 3D Mounting Technology for Optimization of Product Design


Mitsuyo Yamamoto (President & CEO, JOHNAN Corporation)

Junko Takano (Assistant Manager, JOHNAN Corporation)

Location: Tech Theater, Booth 637

Date: Tuesday, February 6

Time: 2:30pm - 3:15pm

Pass Type: Expo (Free), Conference (Paid) - Get your pass now!

Free Content & Activities: Tech Theater

Vault Recording: Not Recorded

The trends in medical device industry are toward portability, wearables, less-invasive approach and non-invasive approach. Designing smaller and/ or complex-shaped devices while integrating necessary functions into them are critical tasks of product design engineers. However, PCB, two-dimensional circuit carrier, can pose limitations in the product designing. MID*, three-dimensional circuit carrier, and 3D Mounting Technology (Surface Mount Technology for non-planer surfaces) is the solution to overcome the limitations and optimize product design. This presentation covers multiple benefits provided by MID and 3D Mounting Technology (e.g., miniaturization, weight reduction, greater design freedom and integration of various functions), related technical topics and applications.

* MID (Molded Interconnect Device): An injection molded component with integrated circuit traces