February 6-8, 2018Anaheim Convention CenterAnaheim, CA
2018 Event Content Schedule
Use the scheduling tool below to browse all the available sessions, speakers and topics at this year's event. Find the content and sessions to fit all of your educational needs and ensure you get the most out of your time at the show.
The trends in medical device industry are toward portability, wearables, less-invasive approach and non-invasive approach. Designing smaller and/ or complex-shaped devices while integrating necessary functions into them are critical tasks of product design engineers. However, PCB, two-dimensional circuit carrier, can pose limitations in the product designing. MID*, three-dimensional circuit carrier, and 3D Mounting Technology (Surface Mount Technology for non-planer surfaces) is the solution to overcome the limitations and optimize product design. This presentation covers multiple benefits provided by MID and 3D Mounting Technology (e.g., miniaturization, weight reduction, greater design freedom and integration of various functions), related technical topics and applications.
* MID (Molded Interconnect Device): An injection molded component with integrated circuit traces